[Okgrants] Learn About Opportunities for Community Colleges Through the CHIPS Act

[Fisher, Christine]

Please see CC webinar opportunity below.

Thank you,

Christine Fisher
Coordinator of Grant Writing and External Funding Assistance
Oklahoma State Regents for Higher Education
655 Research Parkway Suite 200
Oklahoma City, OK 73104
cfisher at osrhe.edu
T: 405-225-9265
[cid:image002.jpg at 01D5F860.453EF380]     [cid:image004.png at 01D5F860.453EF380]


[AACC Bulletin Header]
The CHIPS Act: Opportunities for Community Colleges

When: May 22, 2023, 2:00 p.m. (ET)

Register here.<http://echo4.bluehornet.com/ct/102084269:TI9sn8GyN:m:1:2022232851:889A251EA4870F1799214E214F1B5C66:r>

The CHIPS Act provided approximately $50 billion to spur domestic fabrication of semiconductors and research and development in this cutting-edge field. The U.S. Department of Commerce, through the CHIPS for America Program Office at the National Institute of Standards and Technology, is overseeing the distribution of these funds. Grant applications from chip manufacturers and others must include a detailed workforce development plan, spurring partnerships between businesses and workforce education providers at the local, state and regional levels. Workforce development is also a vital component of the supported R&D activities.

Attend this free webinar<http://echo4.bluehornet.com/ct/102084269:TI9sn8GyN:m:1:2022232851:889A251EA4870F1799214E214F1B5C66:r> on May 22 to learn what you need to know about this opportunity directly from CHIPS for America Program Office officials.

Panelists:

Rachel Lipson, Senior Policy Advisor, CHIPS for America, U.S. Dept. of Commerce
Kylie Patterson, Senior Advisor for Opportunity and Inclusion, CHIPS for America, U.S. Dept. of Commerce
Rodney Peterson, R&D Education and Workforce Advisor, CHIPS for America, U.S. Dept. of Commerce
Moderator: Jim Hermes, Associate Vice President, Government Relations, AACC

Register now!<http://echo4.bluehornet.com/ct/102084269:TI9sn8GyN:m:1:2022232851:889A251EA4870F1799214E214F1B5C66:r>
[AACC Bulletin Footer]

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